UV + Moisture Dual-Cure Adhesive

Advanced Dual-Cure Technology for Reliable Electronic Protection & Bonding

XINCHENG UV + Moisture Dual-Cure Adhesive is a one-component adhesive that combines rapid UV curing with moisture-activated secondary curing. It enables fast component positioning under UV exposure while allowing shadowed areas to cure at room temperature through ambient moisture.

Designed for precision dispensing, the adhesive offers strong adhesion to PCB substrates, wires, PC, PMMA, metals, and alloys. Its tough, low-stress, low-shrinkage formulation provides reliable bonding, component protection, and moisture sealing for demanding electronic applications.

Key Features

* One-Component, Easy-to-Use Formulation
* Fast UV Curing & Moisture Secondary Curing
* Excellent Dispensing Performance
* UV-Detectable Formulations
* Low Shrinkage & Low-Stress Bonding
* Strong Adhesion & Reliable Protection

Typical Applications

* WLCSP and BGA Protection on PCBs
* Component Protection on Battery Management and Protection Boards
* USB Type-C Cable Sealing and Waterproofing (Up to IP68 with Validated Assembly Design)
* Localized PCB Protection and Moisture Sealing
* Precision Bonding of Electronic Components