Two-Component Epoxy Adhesive for Bonding and Encapsulation
XINCHENG manufactures and supplies two-component epoxy adhesives for structural bonding, sealing, potting and encapsulation in electronic and electrical assemblies.
Typical Applications
- Bonding metals, ceramics, glass, wood and compatible plastics
- Sealing and encapsulating electronic components
- Equipment potting, reinforcement and gap filling
- Applications with specific thermal or electrical requirements
Selecting an Epoxy Grade
Tell us your substrates, bond or potting dimensions, mixing and dispensing method, required working time and available curing conditions. Include the operating temperature and any impact, vibration or moisture exposure requirements.
Mixing ratio, viscosity, hardness, working time and cure schedule are grade-specific. Thermal and electrical properties also vary by formulation. Request the technical data for the selected grade before defining your production process.
Discuss Your Project with Our Factory
Send your application details, estimated order quantity and delivery country. Contact XINCHENG for product selection, technical information, sample availability and a quotation.
