{"id":708,"date":"2026-10-20T17:26:46","date_gmt":"2026-10-20T09:26:46","guid":{"rendered":"http:\/\/www.xinchengadhesives.com\/?post_type=product&#038;p=708"},"modified":"2026-10-24T15:48:10","modified_gmt":"2026-10-24T07:48:10","slug":"heraeus","status":"publish","type":"product","link":"https:\/\/www.xinchengadhesives.com\/ja\/product\/heraeus\/","title":{"rendered":"Chip-Level Underfill Adhesive"},"content":{"rendered":"<h2>Chip-Level Underfill Adhesive for Semiconductor Assembly<\/h2>\n<p>XINCHENG manufactures and supplies modified epoxy underfill adhesives for chip-scale packaging and related semiconductor assembly applications. Grade selection should address the package design, gap dimensions and manufacturing process.<\/p>\n<h3>Application Evaluation<\/h3>\n<ul>\n<li>Underfill in chip-scale package (CSP) assemblies<\/li>\n<li>Narrow-gap filling in semiconductor packages<\/li>\n<li>Related wafer-bonding requirements, subject to grade and process evaluation<\/li>\n<\/ul>\n<h3>Discuss Your Package Requirements<\/h3>\n<p>Share the package type, gap dimensions, substrate materials, surface condition and flux residues. Include the dispensing process, curing profile and required reliability tests.<\/p>\n<p>Flow behavior, ionic content, glass transition temperature (Tg), mechanical properties, electrical properties and flux compatibility are grade-specific. Request the applicable technical data and validate filling, cure and reliability in your assembly.<\/p>\n<h3>Contact Our Factory<\/h3>\n<p>Send your project details, estimated order quantity and delivery country. Ask XINCHENG for product selection, technical information, sample availability and a quotation.<\/p>\n<p><a href=\"https:\/\/www.xinchengadhesives.com\/ja\/contact\/\">Request a Quote<\/a> | <a href=\"https:\/\/wa.me\/8613622396161\">Discuss on WhatsApp<\/a><\/p>","protected":false},"excerpt":{"rendered":"<p>An epoxy underfill adhesive manufactured by XINCHENG for chip-scale packaging and related semiconductor assembly applications. Discuss your package design, gap dimensions and manufacturing process directly with our factory.<\/p>","protected":false},"featured_media":765,"template":"","meta":{"site-sidebar-layout":"default","site-content-layout":"default","ast-global-header-display":"","ast-main-header-display":"","ast-hfb-above-header-display":"","ast-hfb-below-header-display":"","ast-hfb-mobile-header-display":"","site-post-title":"","ast-breadcrumbs-content":"","ast-featured-img":"","footer-sml-layout":"","theme-transparent-header-meta":"default","adv-header-id-meta":"","stick-header-meta":"","header-above-stick-meta":"","header-main-stick-meta":"","header-below-stick-meta":""},"product_brand":[],"product_cat":[21],"product_tag":[],"class_list":["post-708","product","type-product","status-publish","has-post-thumbnail","product_cat-products","desktop-align-center","tablet-align-left","mobile-align-left","ast-product-gallery-layout-horizontal-slider","ast-product-tabs-layout-horizontal","first","instock","shipping-taxable","product-type-simple"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v28.7 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Chip-Level Underfill Adhesive Manufacturer | XINCHENG<\/title>\n<meta name=\"description\" content=\"Explore XINCHENG epoxy underfill adhesive for chip-scale packaging and semiconductor assembly. 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