LED Backlight Fixing Adhesive

One-component, low-temperature-curing epoxy adhesives for LED backlight lens fixation, including PC lens-to-aluminum bonding. Strong adhesion, high toughness and rapid heat curing without mixing.

Contact XINCHENG for grade selection and solutions tailored to your materials, dispensing process and curing requirements.

LED Backlight Fixing Adhesive for PC Lens Bonding

XINCHENG manufactures one-component, low-temperature-curing modified epoxy adhesives for LED backlight lens fixation. These adhesives are designed to cure rapidly with heat and provide strong adhesion and high toughness for electronic assembly applications, including bonding PC lenses to aluminum substrates.

Grades can be selected and tailored to customer materials, dispensing processes and curing requirements. Contact our factory to discuss a grade suited to your application.

Key Features

  • One-component formulation: no mixing required
  • Low-temperature, rapid heat curing
  • Strong adhesion and high toughness
  • Good storage stability under the specified conditions for the selected grade
  • Rework possible under suitable conditions, subject to grade and application

Typical Applications

  • LED backlight lens bonding and fixation
  • PC lens-to-aluminum substrate bonding
  • Bonding and reinforcement of active and passive components in PCBA assemblies
  • Temperature-sensitive electronic assemblies, including memory cards and CCD/CMOS components, subject to compatibility evaluation

Application Case Study: PC Lens-to-Aluminum Bonding

Watch actual pull, flexing and drop demonstrations of bonded LED backlight samples. The featured samples used an 85°C / 5-minute curing schedule; curing conditions depend on the selected grade and application.

View the LED Backlight Bonding Case Study →

Grade Selection and Customized Requirements

Tell us your lens and substrate materials, surface condition, adhesive amount, bond geometry, dispensing method and available heating conditions. Include any required toughness, operating conditions or rework requirements.

Curing temperature and time, viscosity, storage requirements and other technical properties depend on the selected grade. Request the relevant technical information and evaluate samples in your actual assembly before defining your production process.

Discuss Your Project with Our Factory

Contact XINCHENG for grade selection, customized requirements, technical information, sample availability and a quotation. Please include your estimated order quantity and delivery country.

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