UV + Moisture Dual-Cure Adhesive for Electronics
XINCHENG manufactures and supplies a one-component adhesive that combines UV curing with moisture-activated secondary curing. UV exposure enables initial positioning, while the secondary cure mechanism addresses areas shielded from UV light.
Typical Applications
- Localized protection of WLCSP and BGA assemblies on PCBs
- Component protection on battery management and protection boards
- USB Type-C cable sealing
- Localized PCB protection and precision electronic bonding
Match the Grade to Your Assembly
Share your substrates, adhesive geometry, shadowed areas, UV equipment and available curing time. Ambient humidity and the depth of shielded areas are important factors to discuss when evaluating the secondary cure.
Adhesion, shrinkage, stress and UV detectability depend on the selected grade. Request the applicable technical data and evaluate the adhesive on your actual components. Any assembly-level waterproof rating must be verified on the finished assembly.
Contact Our Factory
Send your bonding or sealing requirements, estimated order quantity and delivery country. Ask XINCHENG for grade-specific technical information, sample availability and a quotation.
