Chip-Level Underfill Adhesive

Product Description：

Chip-Level Underfill Adhesive is a modified, high-purity epoxy adhesive engineered for advanced semiconductor packaging applications. It offers high volume resistivity, high flexural modulus and strength, a high glass transition temperature (Tg), low ionic content, and excellent filling performance in ultra-fine gaps.

Designed for CSP (Chip-Scale Package) encapsulation and wafer bonding, this material helps enhance package integrity and reliability under demanding operating conditions.

Key Features：

* High Purity & Low Ionic Content – Helps minimize ionic contamination in sensitive electronic assemblies.
* Excellent Micro-Gap Filling – Designed to fill narrow gaps in advanced semiconductor packaging.
* High Tg & Mechanical Strength – Provides high flexural modulus and strength for reliable structural support.
* Excellent Thermal Performance – Suitable for applications involving high and low temperature conditions.
* Excellent Flux Compatibility – Compatible with flux residues and materials used in relevant assembly processes, subject to process validation.

Applications：

* CSP Packaging – For underfill applications in chip-scale package assemblies.
* Wafer Bonding – For bonding and securing wafers in semiconductor manufacturing processes.

Technical Support：

Contact our technical team for product specifications, processing recommendations, and application compatibility testing tailored to your manufacturing requirements.