Chip-Level Underfill Adhesive for Semiconductor Assembly
XINCHENG manufactures and supplies modified epoxy underfill adhesives for chip-scale packaging and related semiconductor assembly applications. Grade selection should address the package design, gap dimensions and manufacturing process.
Application Evaluation
- Underfill in chip-scale package (CSP) assemblies
- Narrow-gap filling in semiconductor packages
- Related wafer-bonding requirements, subject to grade and process evaluation
Discuss Your Package Requirements
Share the package type, gap dimensions, substrate materials, surface condition and flux residues. Include the dispensing process, curing profile and required reliability tests.
Flow behavior, ionic content, glass transition temperature (Tg), mechanical properties, electrical properties and flux compatibility are grade-specific. Request the applicable technical data and validate filling, cure and reliability in your assembly.
Contact Our Factory
Send your project details, estimated order quantity and delivery country. Ask XINCHENG for product selection, technical information, sample availability and a quotation.
