Thermally Conductive Silicone Gel

High-Performance Thermal Management Solutions for Electronics

XINCHENG Thermally Conductive Silicone Gel is a one-component, non-curing thermal interface material designed for efficient heat dissipation in sensitive electronic assemblies. Its soft, highly compressible formulation provides excellent gap-filling performance, low thermal resistance, and minimal mechanical stress on components.

Featuring excellent electrical insulation and optimized rheological properties, the gel enables precise, low-pressure dispensing and reliable thermal contact between uneven surfaces.

Key Features

* Efficient Heat Transfer
* Low Thermal Resistance
* Soft, Low-Stress & Compressible
* Excellent Electrical Insulation
* Non-Curing & Easy Dispensing

Typical Applications

Smartphones and mobile devices, computing and networking equipment, data storage systems, automotive electronics, telecommunications equipment, LED lighting, power supplies, set-top boxes, and audio/video modules.