Thermally Conductive Silicone Gel for Electronics
XINCHENG manufactures and supplies a one-component, non-curing thermal interface material for filling gaps between electronic components and heat-transfer surfaces.
典型应用
- Mobile devices, computers and data storage equipment
- Networking and telecommunications equipment
- LED lighting and power supplies
- Automotive electronics and audio/video modules
Match the Material to Your Thermal Design
Share the gap dimensions, contact surfaces, component tolerances, operating temperature and dispensing equipment. Include your thermal performance target, electrical insulation requirements and limits on assembly pressure.
Thermal conductivity, thermal resistance, dispensing behavior and insulation properties must be assessed for the selected grade and application. Request grade-specific technical data and evaluate the material in your assembly.
联系我们的工厂
请提供您的申请详情、预计订购数量及交货国家。请向XINCHENG咨询产品选型、技术信息、样品供应情况及报价。.
